Information on exhibiting at Intermold 2024
A trade fair specialising in ‘Die & Mould and Metal Stamping’ will be held in Osaka, a major business centre in Japan, for three days from 17 to 19 April. The exhibition focuses on the challenges faced by die and mould makers and die and mould users, and the evolution of the machine tools and tool software that support them, in order to respond to the changing environment surrounding the manufacturing industry.
We look forward to welcoming you at our stand and sincerely hope that we can provide you with specific solutions to meet your requirements. We look forward to seeing you at the exhibition.
Location: Osaka INTEC